Scope of application
1.Support 8*12mm paper tape / floating tape packaging
2.Support 0603-1608 (metric system) SMD components testing & packaging
3.Suitable for high-speed testing& packaging of small-sized RC components
4.The minimum testing&packaging size is 0.6*0.3mm
5.MAX Speed: 5500pcs/min
1. A complete set of imported ultra-high-speed wafer feeding system imported from Japan
2. Configurable 12-inch LCD display human-machine interface (customizable screen)
3.High-speed control system(MITSUBISHI ELECTRIC-R series)
4.Japan ORIENTAL MOTOR + SOEM customized high-speed driver
5.Independent research and development of core precision components
6.Can be equipped with 4 stations of CCD vision (turntable up and down station/paper tape station/finished product station)
7.Optional HIOKI/ADEX high-speed measuring instruments
8.Optional barcode comparison system & data acquisition system & MES upload & automatic generation of production reports
9. Life early warning system for consumable parts
10.Equipment size:1250*600*1300mm
SOEM Pro1.2 Performance and important parameters
1. Feeding system: DAISHIN & SHINKO
2. Pneumatic components: SMC
3. Electronic control components: OMRON & PANASONIC & KEYENCE etc.
4. Moving parts: ORIENTAL MOTOR
5. Control system (MITSUBISHI ELECTRIC-R series)
6. Diversified packaging model
7.Vision system customization development(Speed:10K/min)
8. Production management system custom development: software set and save product test parameters, can bring out the corresponding parameters according to the work order and material number and set instruments, save test records
9. Life warning system for consumable parts
10.Equipment size:1250*600*1300
●Packaging Capacity(pcs/min):
SIZE(Metric System) | CHIP-R | MLCC |
0402 | 3800 | 3800 |
0603 | 5500 | 5500 |
0804 | - | - |
1005 | 5000 | 5000 |
1412 | - | - |
1608 | 3800 | 3600 |